Unis Co., Ltd. - Business Electroless Tin Plating Solution

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Unis Co., Ltd.

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+82.51.303.5080

PSN-500

Advantages

Formation of Leveled Plating Layer (Provides regular depositions & uniformed surface to high resolution circuit patterns.)

NO whisker

Excellent Solderability and Adhesion (Provides excellent solderability & adhesion)

High stability

Performance
Control Parameters	New Tin Plating (Domestic)
Sn2²⁺ Concentration	27.0 ~ 38.0g/ℓ
Acid Concentration	2.8 ~ 4.2N
Cu Concentration	Max. 20.0g/ℓ
Specific Gravity	1.21 ~ 1.27