Surface treatment of lead frame, which is a core material working as a lead to connect semiconductor chips and an external circuit, and as a frame to fix semiconductor package to an electronic circuit board.
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Product | Concentration | Temp | Treatment Method | Time | Purpose |
---|---|---|---|---|---|
2200MU | 100 vol% | 25 ± 5 ˚C | Dipping or Spray | 20~60sec | Cu Micro Etching |
2200RE | 100 vol% | 25 ± 5 ˚C | Dipping or Spray | 20~60sec | Cu Micro Etching |
727ABO | 0.3 vol% over | 25 ± 5 ˚C | Dipping or Spray | 10sec over | RBO agent |
A-800 | 100 ± 50 gr/lt | 25 ± 5 ˚C | Dipping or Spray | 7sec over | Pretreatment agent for plating |
AT-500A | 5 vol% over | 35 ± 5 ˚C | Dipping or Spray | 10sec over | CPO & RBO agent |
AUS-100 | 100 gr/lt over | 30 ± 5 ˚C | Dipping or Spray | 10sec over | Gold Stripper |
CP-5000 | 10 ± 5 vol% | 25 ± 5 ˚C | Dipping or Spray | 7sec over | Cu chemical polishing |
DFM-3 | 15 vol% over | 40 ± 5 ˚C | Dipping or Spray | 10sec over | P.R stripper |
DFM-1 | 15 ± 5 vol% | 50 ± 5 ˚C | Spray or Ultrasonic | 40~120sec | DRY FILM stripping |
ES-500A | 5 vol% over | ROOM | Dipping & Spray | Soft etchant | |
NIB-1, NIB-2 | control | 40~55 ˚C | Dipping or Spray | 40~120sec | Sulfamic acid nickel plating additive |
CP-3000 | 10 ± 5 vol% | Room temperature | Dipping or Spray | 7sec over | Ni chemical polishing |
PRC-100 | 100 vol% | 25 ± 5 ˚C | 3 ASD over | 25sec over | plating Cu |
TCE-100 | 10 ± 5 vol% | 25 ± 5 ˚C | 1 ASD over dipping | 7~20sec | Electro Cleaner |
U202 | 100 vol% | 45 ± 5 ˚C | 0.5 ASD over | 10sec over | Cu strike |
U4000L | 10 ± 5 vol% | 25 ± 5 ˚C | Dipping or Spray | 7sec over | Cu soft etchant |
U725A | 10 ± 5 vol% | 25 ± 5 ˚C | Dipping or Spray | 7sec over | Ag Anti-immersion |
U750 | 40 gr/lt over | 20 ± 5 ˚C | Dipping or Spray | 10sec over | Ag stripper |
U753 | 15 vol% over | 20 ± 5 ˚C | Dipping or Spray | 10sec over | Ag stripper |
UPR-100 | Photo Resist |