Lead Frame

Surface treatment of lead frame, which is a core material working as a lead to connect semiconductor chips and an external circuit, and as a frame to fix semiconductor package to an electronic circuit board.

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Lead Frame
Product Concentration Temp Treatment Method Time Purpose
2200MU 100 vol% 25 ± 5 ˚C Dipping or Spray 20~60sec Cu Micro Etching
2200RE 100 vol% 25 ± 5 ˚C Dipping or Spray 20~60sec Cu Micro Etching
727ABO 0.3 vol% over 25 ± 5 ˚C Dipping or Spray 10sec over RBO agent
A-800 100 ± 50 gr/lt 25 ± 5 ˚C Dipping or Spray 7sec over Pretreatment agent for plating
AT-500A 5 vol% over 35 ± 5 ˚C Dipping or Spray 10sec over CPO & RBO agent
AUS-100 100 gr/lt over 30 ± 5 ˚C Dipping or Spray 10sec over Gold Stripper
CP-5000 10 ± 5 vol% 25 ± 5 ˚C Dipping or Spray 7sec over Cu chemical polishing
DFM-3 15 vol% over 40 ± 5 ˚C Dipping or Spray 10sec over P.R stripper
DFM-1 15 ± 5 vol% 50 ± 5 ˚C Spray or Ultrasonic 40~120sec DRY FILM stripping
ES-500A 5 vol% over ROOM Dipping & Spray   Soft etchant
NIB-1, NIB-2 control 40~55 ˚C Dipping or Spray 40~120sec Sulfamic acid nickel plating additive
CP-3000 10 ± 5 vol% Room temperature Dipping or Spray 7sec over Ni chemical polishing
PRC-100 100 vol% 25 ± 5 ˚C 3 ASD over 25sec over plating Cu
TCE-100 10 ± 5 vol% 25 ± 5 ˚C 1 ASD over dipping 7~20sec Electro Cleaner
U202 100 vol% 45 ± 5 ˚C 0.5 ASD over 10sec over Cu strike
U4000L 10 ± 5 vol% 25 ± 5 ˚C Dipping or Spray 7sec over Cu soft etchant
U725A 10 ± 5 vol% 25 ± 5 ˚C Dipping or Spray 7sec over Ag Anti-immersion
U750 40 gr/lt over 20 ± 5 ˚C Dipping or Spray 10sec over Ag stripper
U753 15 vol% over 20 ± 5 ˚C Dipping or Spray 10sec over Ag stripper
UPR-100         Photo Resist