Semiconductor Packaging

将半导体芯片安装在基板上,实现电线粘合及环氧树脂成型。

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Semiconductor package
Product Concentration Temp Treatment Method Time Purpose
801CD 100 vol% 60~85˚C Dipping or Ultrasonic 5min. over Mid. Alkali Stand Alone M/C
815ED 20~50 vol% 40~55 ˚C  Electro 4 volt over 2min. over Strong Alkali N/A
815LDB 30 vol% over 40~55 ˚C  Electro 3 volt over 1min. over Strong Alkali N/A
815PPF  min 90% 70~100 ˚C dipping/spray min 3mins Removal oxide on Cu surface
818NC 100 vol% 65~85 ˚C Dipping or Ultrasonic 5min. over Removal various organic/contamination & resin flash on Cu surface
819PC 100 vol% 70~85 ˚C Dipping or Ultrasonic 5min. over Weak Acid deflash
819TW 98 vol% over 70~100 ˚C dipping/spray 5min. over Chemical Deflash
UNIS 761 70% 20 ~ 30˚C   balance Sn/pb stripping for Cu/Cu-alloy, alloy42
UNIS 765 70% 20 ~ 30˚C   balance Sn stripping on Belt or Rack
CP-5000 10~100% 20 ~ 30˚C   5sec~1min Descaling, Polishing for Cu/Cu alloy