装有驱动IC的超精细电路薄膜,连接显示板和FPCB。因为粘贴在薄膜类型材料上,所以可以卷起或折叠,从而进行灵活的设计,减少安装在面板上的产品厚度或尺寸。
Product | Purpose |
---|---|
TCE-100 | Electro Alkali Cleaner |
E-200S | Soft Etchant (Pretreatment before P.R process ) |
UPR-100 | Photo Resist |
DR-300 | Developer |
3000MU/RE | Cu Etchant |
NCR-50A/B | Seed Etchant |
SE-100A/B | Seed Etchant |
PI-100SP | PI Etchant |
C-800N | Neutralizing Agent |
DFM-50 | PR Stripper |
CES-100 | Soft Etchant(Pretreatment before Sn plating ) |
PSN-500S | Immersion Tin Plating |
USR-100/H | Solder Resist Ink |
ML-50 |