COF/2-metal
装有驱动IC的超精细电路薄膜，连接显示板和FPCB。因为粘贴在薄膜类型材料上，所以可以卷起或折叠，从而进行灵活的设计，减少安装在面板上的产品厚度或尺寸。
| Product | Purpose |
|---|---|
| TCE-100 | Electro Alkali Cleaner |
| E-200S | Soft Etchant (Pretreatment before P.R process ) |
| UPR-100 | Photo Resist |
| DR-300 | Developer |
| 3000MU/RE | Cu Etchant |
| NCR-50A/B | Seed Etchant |
| SE-100A/B | Seed Etchant |
| PI-100SP | PI Etchant |
| C-800N | Neutralizing Agent |
| DFM-50 | PR Stripper |
| CES-100 | Soft Etchant(Pretreatment before Sn plating ) |
| PSN-500S | Immersion Tin Plating |
| USR-100/H | Solder Resist Ink |
| ML-50 |